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Titel:

Broad-Band Modeling of Bond Wire Antenna Structures

Dokumenttyp:
Konferenzbeitrag
Art des Konferenzbeitrags:
Textbeitrag / Aufsatz
Autor(en):
Russer, J. A.; Mukhtar, F.; Wane, S.; Bajon, D.; Russer, P.
Abstract:
In this paper we propose the usage of bond wires as antennas for chip-to-chip communications. A wireless bond-wire communication link is designed and investigated experimentally. A lumped element two-port equivalent circuit model is established using a system-identification-based combined Bartlett-Brune approach.
Kongress- / Buchtitel:
Microwave Conference (GeMiC), 2012 The 7th German
Kongress / Zusatzinformationen:
Ilmenau, Germany, Mar 12 - 14, 2012
Konferenzort:
Ilmenau, Germany
Verlag / Institution:
IEEE Xplore Digital Library
Jahr:
2012
Quartal:
1. Quartal
Jahr / Monat:
2012-03
Monat:
Mar
Seiten:
1 - 4
Print-ISBN:
978-1-4577-2096-3
Reviewed:
ja
Sprache:
en
Erscheinungsform:
Print
WWW:
http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=6185154
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