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Title:

COMSOL API based Toolbox for the Mixed-Level Modeling of Squeeze-Film Damping in MEMS: Simulation and Experimental Validation

Document type:
Konferenzbeitrag
Contribution type:
Textbeitrag / Aufsatz
Author(s):
Niessner, M. ; Schrag, G.; Iannacci, J.; Wachutka, G.
Book / Congress title:
Proceedings of the 5th Europeans COMSOL Conference
Congress (additional information):
COMSOL CONFERENCE 2011, October 26-28, Stuttgart, Germany
Year:
2011
Reviewed:
ja
Language:
de
Publication format:
CD-ROM / DVD
Format:
Text
 BibTeX