Evaluation of Thermal Transient Characterization Methodologies for High.Power LED Applications
Proceedings of the 17th International Workshop on Thermal Investigations of ICs and Systems
THERMINIC 2011, September 27-29, Paris, France
2011
"Macromodel-based simulation and measurement of thed ynamic pull-in of vicously damped RF-MEMS switches"
Sensors and Actuators A
2011
A 172
269-279
Numerische Untersuchungen zum Ausfall von Leistuungsdioden aufgrund von Höhenstrahlung
40. Kolloquium Halbleiter-Leistungsbauelemente und ihre systemtechnische Anwendung
2011, Oktober 24-25, Freiburg i. B., Germany
2011
Numerical Analysis of Cosmic Radiation-Induced Failures in Power Diodes
pp. 355-358
Proceedings of the European Solid-State Device Research Conference 2011
ESSDERC 2011, Sept. 12-16, Helsinki, Finnland
2011
Electromechanical and electromagnetic simulation of RF-MEMS complex networks based on compact modeling approach
pp. 591-594
Proceedings of TechConnect World NSTI Nanotech/Microtech 2011
NSTI NANOTECH 2011, Boston, MA, USA, June 13-16
2011
COMSOL API based Toolbox for the Mixed-Level Modeling of Squeeze-Film Damping in MEMS: Simulation and Experimental Validation
Proceedings of the 5th Europeans COMSOL Conference
COMSOL CONFERENCE 2011, October 26-28, Stuttgart, Germany
2011
Mechanical Contact in System-level Models of Electrostatically Actuated RF-MEMS Switches: Experimental Analysis and Modeling
80660Y-1-9
Proceedings of SPIE: Smart Sensors, Actuators and MEMS V
SPIE Microtechnologies 2011, April 18-20, Prague, Czech Republic
2011
A Reconfigurable Impedance Matching Network Entirely Manufactured in RF-MEMS Technology
80660X-1-12
Proceedings of SPIE: Smart Sensors, Actuators and MEMS V
SPIE Microtechnologies 2011, April 18-20, Prague, Czech Republic
2011