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Title:

Generation of 3-dimensional power modules for high temperature applications by thermal copper coating processes

Document type:
Konferenzbeitrag
Author(s):
Hensel, Alexander; Schwarzer, Christian; Merz, Corinna; Stoll, Thomas; Kaloudis, Michael; Franke, Joerg
Book / Congress title:
2019 IEEE 21st Electronics Packaging Technology Conference (EPTC)
Publisher:
IEEE
Date of publication:
01.12.2019
Year:
2019
Fulltext / DOI:
doi:10.1109/eptc47984.2019.9026619
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