User: Guest  Login
Document type:
Konferenzbeitrag 
Author(s):
Cuili Chen ; Volker Pickert ; Charalampos Tsimenidis ; Xiang Lu ; Maher Al-Greer ; Thillainathan Logenthiran; Chong Ng; Chunjiang Jia 
Title:
Signal Sweeping Technique to Decouple the Influence of Junction Temperature and Bondwire Lift-off in Condition Monitoring for Multichip IGBT Modules 
Abstract:
This paper proposes a measurement technique applied to an unbiased multi-chip power module that is able to distinguish between junction temperature variation and bondwire lift-off. Compared with traditional approaches, the proposed technique requires only one test to monitor and discriminate these two conditions. The proposed technique relies upon the injection of high frequency/low power signals into the Gate-Emitter terminals of an IGBT and then analysing the corresponding frequency response o...    »
 
Book / Congress title:
CIPS 2018; 10th International Conference on Integrated Power Electronics Systems 
Date of congress:
20.03.2018 - 22.03.2018 
Publisher:
VDE 
Date of publication:
05.06.2018 
Year:
2018 
Year / month:
2018-03 
Month:
Mar 
Print-ISBN:
978-3-8007-4540-1 
Language:
en