Evaluation of methods for coregistration and fusion of RPAS-based 3D point clouds and thermal infrared images

This paper discusses the automatic coregistration and fusion of 3d point clouds generated from aerial image sequences and corresponding thermal infrared (TIR) images. Both RGB and TIR images have been taken from a RPAS platform with a predefined flight path where every RGB image has a corresponding TIR image taken from the same position and with the same orientation with respect to the accuracy of the RPAS system and the inertial measurement unit. To remove remaining differences in the exterior orientation, different strategies for coregistering RGB and TIR images are discussed: (i) coregistration based on 2D line segments for every single TIR image and the corresponding RGB image. This method implies a mainly planar scene to avoid mismatches; (ii) coregistration of both the dense 3D point clouds from RGB images and from TIR images by coregistering 2D image projections of both point clouds; (iii) coregistration based on 2D line segments in every single TIR image and 3D line segments extracted from intersections of planes fitted in the segmented dense 3D point cloud; (iv) coregistration of both the dense 3D point clouds from RGB images and from TIR images using both ICP and an adapted version based on corresponding segmented planes; (v) coregistration of both image sets based on point features. The quality is measured by comparing the differences of the back projection of homologous points in both corrected RGB and TIR images.     «

This paper discusses the automatic coregistration and fusion of 3d point clouds generated from aerial image sequences and corresponding thermal infrared (TIR) images. Both RGB and TIR images have been taken from a RPAS platform with a predefined flight path where every RGB image has a corresponding TIR image taken from the same position and with the same orientation with respect to the accuracy of the RPAS system and the inertial measurement unit. To remove remaining differences in the exterior...     »