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Titel:

Nanolead-free solder alloys for electronic packaging and integration

Dokumenttyp:
Zeitschriftenaufsatz
Autor(en):
Hammad, A.E.; El-Molla, S.
Abstract:
Synthesis of metal nanoparticles with specific properties is a newly established research area attracting a great deal of attention. Several methods have been put forward for synthesis of these materials, namely chemical vapor condensation, arc discharge, hydrogen plasma-etal reaction, and laser pyrolysis in the vapor phase, microemulsion hydrothermal, sol-gel, sonochemical. Nanoscale lead-free soldrs (i.e., Sn-xAg [x 0 0, 20, 40, 60, 0, 100(wt%)], Sn-3.0Ag-0.5Cu, Sn-3.5Ag-0.5Cu, Sn-3.5Ag-xZn (x...     »
Stichworte:
nanolead-free solders, alloy, melting temperature, wettability, mechanical properties, microstructure
Zeitschriftentitel:
International Journal of Materials Engineering and Technology, Volume 15, Number 1, 2016, Pages 23-62, 2016-05
Jahr:
2016
Jahr / Monat:
2016-05
Quartal:
2. Quartal
Monat:
May
Seitenangaben Beitrag:
23-62
Sprache:
en
Volltext / DOI:
doi:10.17654/MT015010023
WWW:
%2520http%253A//dx.doi.org/10.17654/MT015010023
Verlag / Institution:
Pushpa Publishing House PP, Allahabad, India
Print-ISSN:
0975-0444
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