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- Title:
Impact of Electrostatic Coupling and Wafer-Bonding Defects on Delay Testing of Monolithic 3D Integrated Circuits
- Author(s):
- Koneru, Abhishek; Kannan, Sukeshwar; Chakrabarty, Krishnendu
- Journal title:
- ACM Journal on Emerging Technologies in Computing Systems
- Year:
- 2017
- Journal volume:
- 13
- Journal issue:
- 4
- Pages contribution:
- 1-23
- Fulltext / DOI:
- doi:10.1145/3041026
- Publisher:
- Association for Computing Machinery (ACM)
- E-ISSN:
- 1550-4832
- Date of publication:
- 11.07.2017
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