Modeling and numerical simulation of electroplating facilities: coupling ion transport, electric field and fluid flow

A mathematical model for electroplating processes involves equations for multi-ion transport, electric field, electrode-surface kinetics and fluid flow. Along with the solution of these (coupled) equations, several challenges have to be faced. In this presentation we first summarize the mathematical problem formulation and its properties. We then develop a stabilized finite element formulation for both the spatial discretization of the ion-transport model and the Navier-Stokes equations. This formulation is tested along with some numerical examples. Finally, we discuss challenges, advances and future steps of our current work towards the development of a predictive tool for industrial electroplating applications.     «

A mathematical model for electroplating processes involves equations for multi-ion transport, electric field, electrode-surface kinetics and fluid flow. Along with the solution of these (coupled) equations, several challenges have to be faced. In this presentation we first summarize the mathematical problem formulation and its properties. We then develop a stabilized finite element formulation for both the spatial discretization of the ion-transport model and the Navier-Stokes equations. This fo...     »