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Title:

Image-based microstructural simulation of thermal conductivity for highly porous wood fiber insulation boards

Document type:
Zeitschriftenaufsatz
Author(s):
Andrä, Heiko ; Dobrovolskij, Dascha ; Engelhardt, Max ; Godehardt, Michael ; Makas, Michael ; Mercier, Christian ; Rief, Stefan ; Schladitz, Katja ; Staub, Sarah ; Trawka, Karol ; Treml, Sebastian
Keywords:
Original ; Wood Science & Technology ; Ceramics, Glass, Composites, Natural Materials ; Manufacturing, Machines, Tools, Processes
Journal title:
Wood Science and Technology
Year:
2022
Journal volume:
57
Journal issue:
1
Pages contribution:
5-31
Fulltext / DOI:
doi:10.1007/s00226-022-01434-6
Publisher:
Springer Berlin Heidelberg
E-ISSN:
0043-7719 ; 1432-5225
Date of publication:
03.12.2022
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