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Title:

Thermal simulation of cable accessories: Comparison of different methods

Document type:
Konferenzbeitrag
Contribution type:
Textbeitrag / Aufsatz
Author(s):
Höfer, L.; Koch, M.; Heckel, M.
Pages contribution:
483-489
Book / Congress title:
VDE High Voltage Technology 2020; ETG-Symposium
Date of congress:
09.-11. November
Publisher:
VDE
Publisher address:
Berlin
Year:
2020
Print-ISBN:
978-3-8007-5353-6
Reviewed:
ja
Language:
en
WWW:
https://ieeexplore.ieee.org/document/9275512
TUM Institution:
SoED, HSA
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