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Title:

Overview of Carbon Nanotube Processing Methods

Document type:
Buchbeitrag
Author(s):
Franz Kreupl
Pages contribution:
81-100
Abstract:
On February 16, in year 2000, the first patent application was filed that proposed to use carbon nanotubes (CNTs) instead of metals as vertical interconnects in advanced microelectronic interconnects on semiconductor chips [1]. This patent, which has been cited in over 150 following patent applications as prior art, emphasizes that CNTs would be especially useful in vertical interconnects (vias). The quasi-ballistic current transport in CNTs would allow very efficient low resistance interconnect...     »
Editor:
Springer
Book title:
Carbon Nanotubes for Interconnects: Process, Design and Applications
Publisher:
Springer
Date of publication:
10.07.2016
Year:
2016
Pages:
20
Covered by:
Web of Science
DOI:
doi:10.1007/978-3-319-29746-0_3
WWW:
http://link.springer.com/chapter/10.1007%2F978-3-319-29746-0_3
TUM Institution:
Hybride Elektronische Systeme
Format:
Text
 BibTeX