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Title:

Impact of Electrostatic Coupling and Wafer-Bonding Defects on Delay Testing of Monolithic 3D Integrated Circuits

Author(s):
Koneru, Abhishek; Kannan, Sukeshwar; Chakrabarty, Krishnendu
Journal title:
ACM Journal on Emerging Technologies in Computing Systems
Year:
2017
Journal volume:
13
Journal issue:
4
Pages contribution:
1-23
Fulltext / DOI:
doi:10.1145/3041026
Publisher:
Association for Computing Machinery (ACM)
E-ISSN:
1550-4832
Date of publication:
11.07.2017
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