A novel design approach for a piezoelectric MEMS-microphone is developed, where the multilayered membrane is able to compensate intrinsic stress caused by the fabrication process. The optimization is based on a calibrated electro-mechanical FEM model that is parameterized by significant variables as determined by a statistical analysis of variance. Eventually a Kirchhoffian network model of the package-induced damping is added, leading to the prediction of an amplified microphone sensitivity of -40,6 dBV.
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A novel design approach for a piezoelectric MEMS-microphone is developed, where the multilayered membrane is able to compensate intrinsic stress caused by the fabrication process. The optimization is based on a calibrated electro-mechanical FEM model that is parameterized by significant variables as determined by a statistical analysis of variance. Eventually a Kirchhoffian network model of the package-induced damping is added, leading to the prediction of an amplified microphone sensitivity of...
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