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Document type:
Patent 
Patent application number:
US 8912654 B2 
Inventor:
KREUPL FRANZ, HEDLER HARRY 
Title:
Semiconductor chip with integrated via 
Patent office:
US 
Publication date patent:
16.12.2014 
Year:
2014 
Pages:
14 
Language:
en 
Covered by:
Scopus 
TUM Institution:
Hybride Elektronische Systeme 
Format:
Text 
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