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Titel:

Modeling and numerical simulation of electroplating facilities: coupling ion transport, electric field and fluid flow

Dokumenttyp:
Konferenzbeitrag
Art des Konferenzbeitrags:
Textbeitrag / Aufsatz
Autor(en):
Bauer, G.; V., Gravemeier; Wall, W.A.
Seitenangaben Beitrag:
CD-ROM p249
Abstract:
A mathematical model for electroplating processes involves equations for multi-ion transport, electric field, electrode-surface kinetics and fluid flow. Along with the solution of these (coupled) equations, several challenges have to be faced. In this presentation we first summarize the mathematical problem formulation and its properties. We then develop a stabilized finite element formulation for both the spatial discretization of the ion-transport model and the Navier-Stokes equations. This fo...     »
Stichworte:
stabilized finite element method, electroplating, ion transport, computational electrochemistry, instationary convection-diffusion-migration equation
Dewey-Dezimalklassifikation:
620 Ingenieurwissenschaften
Herausgeber:
Schrefler, B.; Onate, E.; Papadrakakis, M.
Kongress- / Buchtitel:
COUPLED PROBLEMS 2009 - Proceedings Int. Conference on Computational Methods for Coupled Problems in Science and Engineering
Ausrichter der Konferenz:
Universität of Padova (Italy), CIMNE (Int. Center for Numerical Methods in Engineering), Technical Universität of Catalonia (UPC), Technical Universität of Athen (Greece)
Jahr:
2009
Monat:
Jun
Reviewed:
ja
Sprache:
en
Erscheinungsform:
CD-ROM / DVD
Semester:
SS 09
Format:
Text
 BibTeX