Login
- Title:
Residual Stress Measurement by Electronic Speckle Pattern Interferometry
- Document type:
- Konferenzbeitrag
- Author(s):
- Sedivy, O.; Krempaszky, C.; Holy, S.
- Book / Congress title:
- Proceedings of 5th Australasian Congress on Applied Mechanics
- Publisher address:
- Brisbane
- Year:
- 2007
- TUM Institution:
- Lehrstuhl für Werkstoffkunde und Werkstoffmechanik
BibTeX