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Dokumenttyp:
Konferenzbeitrag
Autor(en):
Cangellaris, Andreas C.; Russer, Johannes A.
Titel:
EMI/EMC modeling of packaged electronics: Challenges and opportunities
Abstract:
The complexity of EMI/EMC modeling at the package, board and system level of multifunctional electronic designs necessitates the use of approximations in the development of a manageable computer model. Such approximations can be interpreted in terms of geometric, material, and layout variability. This variability, which is also relevant to uncertainties in floor-planning, layout and operating conditions, calls for methodologies and tools for predictive component and system EM performance and fun...     »
Stichworte:
Integrated circuit modeling, electromagnetic interference, Approximation methods, Computational modeling, Electromagnetics, Numerical models, Solid modeling
Kongress- / Buchtitel:
General Assembly and Scientific Symposium, 2011 XXXth URSI
Verlag / Institution:
IEEE
Jahr:
2011
Monat:
August
Seiten:
1--4
Print-ISBN:
978-1-4244-5117-3
Volltext / DOI:
doi:10.1109/URSIGASS.2011.6050760
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