EMI/EMC modeling of packaged electronics: Challenges and opportunities

The complexity of EMI/EMC modeling at the package, board and system level of multifunctional electronic designs necessitates the use of approximations in the development of a manageable computer model. Such approximations can be interpreted in terms of geometric, material, and layout variability. This variability, which is also relevant to uncertainties in floor-planning, layout and operating conditions, calls for methodologies and tools for predictive component and system EM performance and functionality assessment in the presence of uncertainty. Such modeling capability is not available today. This paper explores the opportunities for and potential benefits from the development of such modeling capability in support of EMI/EMC modeling for noise-aware computer-aided integration of multi-functional electronic systems.     «

The complexity of EMI/EMC modeling at the package, board and system level of multifunctional electronic designs necessitates the use of approximations in the development of a manageable computer model. Such approximations can be interpreted in terms of geometric, material, and layout variability. This variability, which is also relevant to uncertainties in floor-planning, layout and operating conditions, calls for methodologies and tools for predictive component and system EM performance and fun...     »