Comparison of electromagnetic solvers for the analysis of LTCC components

We present an accurate modeling of complex vertically integrated structures based on the new LTTC (low-temperature cofired ceramic) multilayer technology. The EM analysis is performed by means of different electromagnetic full-wave solvers in the time- and frequency-domains, namely: i) finite difference time-domain (FDTD); ii) transmission line matrix (TLM); iii) transmission line matrix integral equation (TLM-IE); iv) generalized transverse resonance diffraction (GTRD). We analyze a stacked patch antenna and a spiral inductor. The calculated S-parameters and Q-factors are compared to measured data showing good agreement.     «

We present an accurate modeling of complex vertically integrated structures based on the new LTTC (low-temperature cofired ceramic) multilayer technology. The EM analysis is performed by means of different electromagnetic full-wave solvers in the time- and frequency-domains, namely: i) finite difference time-domain (FDTD); ii) transmission line matrix (TLM); iii) transmission line matrix integral equation (TLM-IE); iv) generalized transverse resonance diffraction (GTRD). We analyze a stacked...     »

time-domain analysis, inductors, electromagnetic field theory, transmission line matrix methods, frequency-domain analysis, S-parameters, Q-factor, finite difference time-domain analysis, time-domain, integral equations, microstrip antennas, multilayers, EM analysis, spiral inductor, Q-factors, frequency-domain, complex vertically integrated structures, electromagnetic solvers, full-wave solvers, low-temperature cofired ceramic components, LTCC component analysis, multilayer technology, stacked patch antenna     «

time-domain analysis, inductors, electromagnetic field theory, transmission line matrix methods, frequency-domain analysis, S-parameters, Q-factor, finite difference time-domain analysis, time-domain, integral equations, microstrip antennas, multilayers, EM analysis, spiral inductor, Q-factors, frequency-domain, complex vertically integrated structures, electromagnetic solvers, full-wave solvers, low-temperature cofired ceramic components, LTCC component analysis, multilayer technology, stacked...     »