Chip-Package-PCB Co-Design and Experimental Co-Verification of Smart Probes for Sensing Stochastic Electromagnetic Fields: Toward Energy-based Metrics

Title:: Chip-Package-PCB Co-Design and Experimental Co-Verification of Smart Probes for Sensing Stochastic Electromagnetic Fields: Toward Energy-based Metrics
Document type:: Konferenzbeitrag
Author(s):: Wane, Sidina; Lesénéchal, Dominique; Bajon, Damienne; Corrales, Pablo; Haider, Michael; Russer, Johannes; Bolomey, Jean-Charles; Patton, Ruska; Baev(, Stéphane Attal andAndrey; Kuznetsov, Yury; Russer, Peter
Abstract:: A proposal for standardisation of Near-Field measurement of Stochastic Electromagnetic Fields led by the European COST Action 1407 has been initiated. This initiative has resulted in an IEEE standard being specified for Single-Probe, Dual-Probe and Multi-Probe scanning systems. The Single-Probe, Dual-probe and Multi-Probe based measurements are compared in terms of their RF, accessible resolution, reliability (including mechanical stress) performances and Test-time for industrial deployment.
Book / Congress title:: Proc. of the 2nd URSI AT-RASC
Publisher address:: Gran Canaria
Year:: 2018
Month:: June
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