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- Title:
Flip-chip bonded Si Schottky diode sampling circuits for high speed demultiplexers
- Document type:
- Konferenzbeitrag
- Author(s):
- Choi, Jung Han; Weiske, C. J.; Olbrich, G. R.; Russer, P.
- Abstract:
- This paper presents a Si Schottky diode sampling circuit for demultiplexer using flip-chip technology on alumina substrate (Al/sub 2/O/sub 3/). In order to design circuits, very high speed Si Schottky diodes, having cutoff frequency of 750 GHz, were modeled using the Root diode model and flip-chip interconnection was simulated using 3 dimensional electromagnetic simulator, HFSS.
- Keywords:
- Coplanar waveguides, demultiplexing equipment, elemental semiconductors, Sampling methods, Schottky diodes, Si, silicon, Al/sub 2/O/sub 3/, alumina substrate, Circuit simulation, flip-chip devices, Integrated circuit interconnections, Root diode model, 750 GHz, Bonding, Cutoff frequency, Electromagnetic modeling, flip-chip bonding, HEMTs, HFSS, high-speed demultiplexer, Logic circuits, Si Schottky diode sampling circuit, signal processing equipment, three-dimensional electromagnetic simulation
- Book / Congress title:
- IEEE MTT-S International Microwave Symposium Digest, 2003
- Volume:
- 3
- Year:
- 2003
- Month:
- June
- Pages:
- 1515--1518 vol.3
- Fulltext / DOI:
- doi:10.1109/MWSYM.2003.1210424
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