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Titel:

Full-wave analysis of discontinuities in uniplanar and multiplanar transmission lines using the frequency-domain TLM method

Dokumenttyp:
Konferenzbeitrag
Autor(en):
Jin, H.; Vahldieck, R.; Russer, P.; Huang, J.
Abstract:
The authors introduce a rigorous analysis of a variety of transmission line transition discontinuities and module interconnect assemblies in MMIC (monolithic microwave integrated circuit) and miniature MIC circuits using the frequency-domain TLM (transmission line matrix) method. Numerical results on frequency-dependent S-parameters are presented which include the effect of finite thickness and conductivity of the metallization as well as mode interaction between cascaded discontinuities. The ef...     »
Stichworte:
MMIC, microwave integrated circuits, transmission line matrix, frequency-domain analysis, transmission lines, hybrid integrated circuits, S-parameters, frequency-domain TLM method, microstrip lines, bonding wire, conductivity, discontinuities, finite thickness, frequency-dependent S-parameters, line transition, metallization, miniature MIC circuits, mode interaction, module interconnect assemblies, monolithic microwave integrated circuit, multiplanar
Kongress- / Buchtitel:
Microwave Symposium Digest, 1993., IEEE MTT-S International
Jahr:
1993
Seiten:
713--716 vol.2
Print-ISBN:
0149-645X
Volltext / DOI:
doi:10.1109/MWSYM.1993.276745
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