microwave integrated circuits, hybrid integrated circuits, microwave oscillators, UHF, surface acoustic wave devices, delay lines, photolithographic technique, transducers, 1.9805 to 2 GHz, 21 dB, acoustic microwave devices, acoustic surface transverse wave, frequency controlling element, hybrid oscillator, low insertion loss, low phase noise, microwave oscillator, radiofrequency oscillators, SAW device, split isolated electrode design, surface transverse wave oscillator, temperature stability, thin metallization, third harmonic, ultrasonic delay lines, Y-cut quartz substrates
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microwave integrated circuits, hybrid integrated circuits, microwave oscillators, UHF, surface acoustic wave devices, delay lines, photolithographic technique, transducers, 1.9805 to 2 GHz, 21 dB, acoustic microwave devices, acoustic surface transverse wave, frequency controlling element, hybrid oscillator, low insertion loss, low phase noise, microwave oscillator, radiofrequency oscillators, SAW device, split isolated electrode design, surface transverse wave oscillator, temperature stability,...
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