Choi, Jung Han; Weiske, C.-J.; Olbrich, Gerhard R.; Russer, Peter
Flip-Chip Bonded Si Schottky Diode Sampling Circuits for High Speed Demultiplexers
This paper presents a Si Schottky diode sampling circuit for demultiplexer using flip-chip technology on alumina substrate (Al/sub 2/O/sub 3/). In order to design circuits, very high speed Si Schottky diodes, having cutoff frequency of 750 GHz, were modeled using the Root diode model and flip-chip interconnection was simulated using 3 dimensional electromagnetic simulator, HFSS.