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Anzinger S., Manz J., Dehe A., Schrag G
A Comb-Based Capacitive MEMS Microphone with High Signal-to-Noise Ratio: Modeling and Noise-Level-Analysis
Proceedings of the Eurosensors 2017/Multidisciplinary Publishing Institute Proceedings, Vol. 1, 2017
Paris, France
2017
Schrag G.
Virtuelles Prototyping - Entwurf von integrierten, multifunktionalen Mikrosystemen
Journal of TECHNIK IN BAYERN (TECHNIK IN BAYERN) (05/2017)
2017
05
pp. 12-13
Schrag, G.; Kuenzig, T.
Towards High Fidelity Silicon Microphones: Evaluating the Potential of Industrial Microsystems Applying Tailored System-level Models
6
Proceedings of 18th International Concerence on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems
Eurosime 2017
2017
Huang, Y.; Erlbacher, T.; Buettner, J.; Wachutka, G.
A Trade-off Between Nominal Forward Current Density and Surge Current Capability for 4,5 kV SiC MPS Diodes
Proceedings of the 2016 28th International Symposium on Power Semiconductor Devices and ICs
2016
Huang, Y.; Wachutka, G.
Comparative Study of Contact Topographies of 4,5 kV SiC MPS Diodes for Optimizing the Forward Characteristics
117-120
Proceedings of Simulation of Semiconductor Processes and Devices
2016
Basler, V.; Basler, T.; Pertermann, E.; Baburske, R.; Lutz, J.; Wachutka, G.
Compact PIN-Diode Model including Dynamic Avalanche and Lifetime Control in MATLAB
2016
Toechterle, C.; Pfirsch, F.; Sandow, C.; Wachutka, G.
Influence of Quasi-3D Filament Geometry onf the Latch-Up Threshold of High-Voltage Trench-IGBTs
177 - 180
Proceedings of Simulation of Semiconductor Processes and Devices
2016
Behlert, R.; Schrag, G.; Wachutka, G.; Wieland, R.; Kutter, C.
Design of an Integrated Piezoelectric Micro-Flapper Based on Bionic Principles
79 - 82
Proceedings of Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS
2016
Schrag, G.; Kuenzig, T.; Dehe, A.
Enhanced Design of Microsystems by Combining Lumped and Distributed System-level Models
61-65
Proceedings of DTIP 2016
2016, Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS
IEEE
2016
Basler, V.; Hoelzl, W.; Wachutka, G.
Physical Modeling and High-Fidelity Simulation of the Transient Behavior of Multiply-Contacted Power Busbars
543-549
PCIM Europe 2016, 10 - 12 May
VDE Verlag GmbH
2016
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