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Document type:
Zeitschriftenaufsatz 
Author(s):
Hammad, A.E.; El-Molla, S. 
Title:
Nanolead-free solder alloys for electronic packaging and integration 
Abstract:
Synthesis of metal nanoparticles with specific properties is a newly established research area attracting a great deal of attention. Several methods have been put forward for synthesis of these materials, namely chemical vapor condensation, arc discharge, hydrogen plasma-etal reaction, and laser pyrolysis in the vapor phase, microemulsion hydrothermal, sol-gel, sonochemical. Nanoscale lead-free soldrs (i.e., Sn-xAg [x 0 0, 20, 40, 60, 0, 100(wt%)], Sn-3.0Ag-0.5Cu, Sn-3.5Ag-0.5Cu, Sn-3.5Ag-xZn (x...    »
 
Keywords:
nanolead-free solders, alloy, melting temperature, wettability, mechanical properties, microstructure 
Journal title:
International Journal of Materials Engineering and Technology, Volume 15, Number 1, 2016, Pages 23-62, 2016-05 
Year:
2016 
Year / month:
2016-05 
Quarter:
2. Quartal 
Month:
May 
Pages contribution:
23-62 
Language:
en 
Publisher:
Pushpa Publishing House PP, Allahabad, India 
Print-ISSN:
0975-0444