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- Autor(en):
- Güngerich, Volker; Schadel, R.; Ramisch, Roland; Russer, Peter H.
- Titel:
- A process for inserting chips into planar microwave structures on semiconductor substrates
- Abstract:
- A process to insert chips into planar microwave structures on semiconductor substrates is described. The process consists mainly of a photolithography step, a wet etching and a connection step and follows conventional thin film technology. Using this process, lower chip-to-circuit inductances compared to wire bonding are achieved. Also, connections are precisely reproducible, which reduces uncertainties in circuit modelling.
- Stichworte:
- GaAs wet etching, hybrid mounting technique, thin film technology
- Zeitschriftentitel:
- Microelectronic Engineering
- Jahr:
- 1992
- Band / Volume:
- 18
- Monat:
- aug
- Heft / Issue:
- 3
- Seitenangaben Beitrag:
- 247--252
- Volltext / DOI:
- doi:10.1016/S0167-9317(05)80005-X
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