Güngerich, Volker; Schadel, R.; Ramisch, Roland; Russer, Peter H.
A process for inserting chips into planar microwave structures on semiconductor substrates
A process to insert chips into planar microwave structures on semiconductor substrates is described. The process consists mainly of a photolithography step, a wet etching and a connection step and follows conventional thin film technology. Using this process, lower chip-to-circuit inductances compared to wire bonding are achieved. Also, connections are precisely reproducible, which reduces uncertainties in circuit modelling.
GaAs wet etching, hybrid mounting technique, thin film technology