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Author(s):
Güngerich, Volker; Schadel, R.; Ramisch, Roland; Russer, Peter H. 
Title:
A process for inserting chips into planar microwave structures on semiconductor substrates 
Abstract:
A process to insert chips into planar microwave structures on semiconductor substrates is described. The process consists mainly of a photolithography step, a wet etching and a connection step and follows conventional thin film technology. Using this process, lower chip-to-circuit inductances compared to wire bonding are achieved. Also, connections are precisely reproducible, which reduces uncertainties in circuit modelling. 
Keywords:
GaAs wet etching, hybrid mounting technique, thin film technology 
Journal title:
Microelectronic Engineering 
Year:
1992 
Journal volume:
18 
Month:
aug 
Journal issue:
Pages contribution:
247--252