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Document type:
Konferenzbeitrag 
Contribution type:
Textbeitrag / Aufsatz 
Author(s):
Max Stelzer, Franz Kreupl 
Title:
Graphenic Carbon-Silicon Contacts for Reliability Improvement of Metal-Silicon Junctions 
Pages contribution:
21.7 
Book / Congress title:
IEEE International Electron Devices Meeting (IEDM) 
Organization:
IEEE 
Date of congress:
6.12.2016 
Year:
2016 
Year / month:
2016-12 
Pages:
Reviewed:
ja 
TUM Institution:
Hybride Elektronische Systeme