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Document type:
Buchbeitrag 
Author(s):
Franz Kreupl 
Title:
Overview of Carbon Nanotube Processing Methods 
Pages contribution:
81-100 
Abstract:
On February 16, in year 2000, the first patent application was filed that proposed to use carbon nanotubes (CNTs) instead of metals as vertical interconnects in advanced microelectronic interconnects on semiconductor chips [1]. This patent, which has been cited in over 150 following patent applications as prior art, emphasizes that CNTs would be especially useful in vertical interconnects (vias). The quasi-ballistic current transport in CNTs would allow very efficient low resistance interconnect...    »
 
Editor:
Springer 
Book title:
Carbon Nanotubes for Interconnects: Process, Design and Applications 
Publisher:
Springer 
Date of publication:
10.07.2016 
Year:
2016 
Pages:
20 
Covered by:
Web of Science 
TUM Institution:
Hybride Elektronische Systeme 
Format:
Text