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- Title:
Temperature modeling and emulation of an ASIC temperature monitor system for Tightly-Coupled Processor Arrays (TCPAs)
- Author(s):
- Glocker, E.; Boppu, S.; Chen, Q.; Schlichtmann, U.; Teich, J.; Schmitt-Landsiedel, D.
- Journal title:
- Advances in Radio Science
- Year:
- 2014
- Journal volume:
- 12
- Pages contribution:
- 103--109
- Fulltext / DOI:
- doi:10.5194/ars-12-103-2014
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