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Pour Aryan, Nasim;Wirnshofer, Martin;Schmitt-Landsiedel, Doris;Georgakos, Georg
An in situ Timing Measurement Method for Reliability Diagnosis of Digital Circuits
Zuverlässigkeit und Entwurf - 7. ITG/GI/GMM-Fachtagung
2013
Pour Aryan, Nasim;Georgakos, Georg;Schmitt-Landsiedel, Doris
Reliability monitoring of digital circuits by in situ timing measurement
International Workshop on Power and Timing Modeling, Optimization and Simulation (PATMOS)
2013
Martiny, N.;Geder, J.;Wang, Yuxi;Kraus, W.;Jossen, A.
Development of a thin-film thermocouple matrix for in-situ temperature measurement in a lithium ion pouch cell
Sensors, 2013 IEEE
2013
Jefremow, M.;Kern, T.;Backhausen, U.;Elbs, J.;Rousseau, B.;Roll, C.;Castro, L.;Roehr, T.;Paparisto, E.;Herfurth, K. Bartenschlager, R.;Thierold, S.;Renardy, R.;Kassenetter, S.;Lawal, N.;Strasser, M.;Trottmann, W.;Schmitt-Landsiedel, D.
A 65nm 4MB Embedded Flash Macro for Automotive Achieving a Read Throughput of 5.7GB/s and a Write Throughput of 1.4MB/s
Proceedings of the ESSCIRC (ESSCIRC)
2013
Glocker, Elisabeth;Boppu, Srinivas;Chen, Qingqing;Schlichtmann, Ulf;Teich, Jürgen;Schmitt-Landsiedel, Doris
Temperature modeling and emulation of an ASIC temperature monitor system for Tightly-Coupled Processor Arrays (TCPAs) on FPGA
KHB
2013
Breitkreutz, S.;Ziemys, G.;Eichwald, I.;Kiermaier, J.;Csaba, G.;Porod, W.;Schmitt-Landsiedel, D.;Becherer, M.
Domain Wall Gate for Magnetic Logic and Memory Applications with Perpendicular Anisotropy
Proceedings of the IEEE International Electron Devices Meeting (IEDM)
2013
Breitkreutz, S.;Eichwald, I.;Schmitt-Landsiedel, D.;Becherer, M.
Perpendicular Nanomagnetic Logic: Nonvolatile Computing with Field-coupled Magnets
8th Workshop on Frontier Electronic (WOFE)
2013
Yilmaz, Cenk;Heiss, Leonhard;Werner, Christoph;Schmitt-Landsiedel, Doris
Modeling of NBTI-recovery effects in analog CMOS circuits
IEEE International Reliability Physics Symposium (IRPS)
2013
Werner, Christoph;Backs, Benedikt;Wirnshofer, Martin;Schmitt-Landsiedel, Doris
Resilience and Yield of Flip-Flops in Future CMOS Technologies under Process Variations and Aging
To appear in: IET Circuits, Devices & Systems
2013
Barke, Martin;Kleeberger, Veit B.;Werner, Christoph;Schmitt-Landsiedel, Doris;Schlichtmann, Ulf
Analysis of Aging Mitigation Techniques for Digital Circuits Considering Recovery Effects
edaWorkshop
2013
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