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Author(s):
Glocker, E.; Boppu, S.; Chen, Q.; Schlichtmann, U.; Teich, J.; Schmitt-Landsiedel, D. 
Title:
Temperature modeling and emulation of an ASIC temperature monitor system for Tightly-Coupled Processor Arrays (TCPAs) 
Journal title:
Advances in Radio Science 
Year:
2014 
Journal volume:
12 
Pages contribution:
103--109 
Fulltext / DOI: