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Document type:
Zeitschriftenaufsatz 
Author(s):
Rivadeneyra, A.; Fernández-Salmerón, J.; Audo-Acemel, M.; Palma, A.J.; Capitan-Vallvey, L.F.; López-Villanueva, J.A. 
Title:
Cantilever Fabrication by a Printing and Bonding Process 
Abstract:
Cantilevers are a widely used structure in electronics, covering many applications from switches to different kinds of sensors. The majority of them have been manufactured with complimentary metal-oxide-semiconductor (CMOS) technologies, but the increasing demand on printed electronics also motivates its development with printing techniques. Here, we present a cantilever beam fabricated by printing techniques with a novel manufacturing process that simplifies the fabrication procedure in terms o...    »
 
Keywords:
Printed electronics cantilever beam plastic foil sacrificial layer sacrificial substrate 
Journal title:
Journal of Microelectromechanical Systems (Volume:24 , Issue: 4 ) 2015-08 
Year:
2015 
Year / month:
2015-08 
Quarter:
3. Quartal 
Month:
Aug 
Pages contribution:
880-886 
Language:
en 
Publisher:
IEEE Explore Digital Library 
Print-ISSN:
1057-7157