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Document type:
Konferenzbeitrag 
Author(s):
Sedivy, O.; Krempaszky, C.; Holy, S. 
Title:
Residual Stress Measurement by Electronic Speckle Pattern Interferometry 
Book / Congress title:
Proceedings of 5th Australasian Congress on Applied Mechanics 
Publisher address:
Brisbane 
Year:
2007 
TUM Institution:
Lehrstuhl für Werkstoffkunde und Werkstoffmechanik