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Author(s):
Koneru, Abhishek; Kannan, Sukeshwar; Chakrabarty, Krishnendu 
Title:
Impact of Electrostatic Coupling and Wafer-Bonding Defects on Delay Testing of Monolithic 3D Integrated Circuits 
Journal title:
ACM Journal on Emerging Technologies in Computing Systems 
Year:
2017 
Journal volume:
13 
Journal issue:
Pages contribution:
1-23 
Publisher:
Association for Computing Machinery (ACM) 
E-ISSN:
1550-4832 
Date of publication:
11.07.2017