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Document type:
Konferenzbeitrag 
Contribution type:
Textbeitrag / Aufsatz 
Author(s):
Cangellaris, A. C.; Russer, J. A. 
Title:
EMI/EMC modeling of packaged electronics: Challenges and opportunities 
Abstract:
Print Request Permissions Save to Project The complexity of EMI/EMC modeling at the package, board and system level of multifunctional electronic designs necessitates the use of approximations in the development of a manageable computer model. Such approximations can be interpreted in terms of geometric, material, and layout variability. This variability, which is also relevant to uncertainties in floor-planning, lay...    »
 
Book / Congress title:
General Assembly and Scientific Symposium 2011, XXXth URSI 
Congress (additional information):
Istanbul, Turkey, Aug 13 - 20, 2011 
Publisher:
IEEE Xplore Digital Library 
Year:
2011 
Quarter:
3. Quartal 
Year / month:
2011-08 
Month:
Aug 
Pages:
1 - 4 
Reviewed:
ja 
Language:
en 
Publication format:
Print 
Format:
Text