User: Guest  Login
Document type:
Konferenzbeitrag
Author(s):
Sedivy, O.; Krempaszky, C.; Holy, S.
Title:
Residual Stresses Measurement by ESPI - Specimen Design
Book / Congress title:
Proceedings of the 12th International Conference on Problems of Material Engineering, Mechanics and Design
Year:
2007
TUM Institution:
Lehrstuhl für Werkstoffkunde und Werkstoffmechanik
 BibTeX