Okeil, H.; Wachutka, G.
500 °C Microtesla Sensitive Magnetic Field Sensing Using a 4H-SiC PIN Diode
IEEE SENSORS JOURNAL
2024
VOL. 24
NO. 19
29884-29889

Schiller, F.; Bretthauer, C.; Bogner, A.; Bosetti, G.; Krenzer, M.; Gierl, K.; Haupt, C.; Heiss, H.
OT1.173 - High-Fidelity Modeling of Harmonic Distortions in Piezoelectric MEMS Microphones with a Corrugated Membrane
33-34
Lectures
EUROSENSORS XXXVI
AMA Service GmbH, Von-Münchhausen-Str. 49, 31515 Wunstorf
2024

Xu, J.; Schrag, G.; Shao, Z.
Machine Learning Strategies for Freeform PMUTs Design
4
IEEE International Ultrasonics Symposium (IUS)
2024

Friebe, T.; Schrag, G.; Bosetti, G.; Bretthauer, C.
C3.2 - Piezoelektrische MEMS-Mikrofone mit Regelung durch Kraftrückkopplung
236-240
Vorträge
22. GMA/ITG-Fachtagung Sensoren und Messsysteme 2024
AMA Service GmbH, Von-Münchhausen-Str. 49, 31515 Wunstorf
2024

Bicer, E. A.; Schirmer, P. A.; Schreivogel, P.; Schrag, G.
Electric Vehicle Thermal Management System Modeling with Informed Neural Networks
1-8
2023 25th European Conference on Power Electronics and Applications (EPE'23 ECCE Europe)
IEEE
2023

Bicer, E. A.; Schirmer P.; Schreivogel P.; Schrag G.
Mesago PCIM GmbH
Neural Network Assisted Numerical Simulation Benchmarking for Electric Vehicle Thermal Management System
VDE VERLAG GMBH
2024
9

Philippin, N.; Kuehne, I.; Schrag, G.
Electric-Field-Assisted Printing Technology for Enhanced Patterning of Micro- and Nanostructures
205-210
MikroSystemTechnik Kongress
2023

Philippin, N.; Kuehne, I.; Schrag, G.
Conformable Electronics with Conductive Silver Structures by Electrohydrodynamic Printing
IEEE Journal on Flexible Electronics
2024
1-1

Philippin, N.; Kuehne, I; Schrag, G.
Electrohydrodynamic Printing of Conductive Microstrips on Hyperelastic Substrates for Fabrication of Flexible and Stretchable Sensors
1-4
2024 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS)
IEEE; VDE
2024

Bosetti, G.; Bretthauer, C.; Bogner, A.; Krenzer, M.; Gierl, K.; Heiss, H.; Schrag, G.
Design Optimization of a Corrugated Piezoelectric MEMS Microphone applying Genetic Algorithms
2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
IEEE
2024