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Document type:
Konferenzbeitrag
Contribution type:
Textbeitrag / Aufsatz
Author(s):
Max Stelzer, Franz Kreupl
Title:
Graphenic Carbon-Silicon Contacts for Reliability Improvement of Metal-Silicon Junctions
Pages contribution:
21.7
Book / Congress title:
IEEE International Electron Devices Meeting (IEDM)
Organization:
IEEE
Date of congress:
6.12.2016
Year:
2016
Year / month:
2016-12
Pages:
4
Reviewed:
ja
TUM Institution:
Hybride Elektronische Systeme
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