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Document type:
Konferenzbeitrag 
Author(s):
Töchterle, C.; Pfirsch, F.; Sandow, C.; Wachutka, G. 
Title:
Analysis of the Latch-up Process and Current Filamentation in High-Voltage Trench-IGBT Cell Arrays 
Pages contribution:
pp 296-299 
Editor:
IEEE 
Book / Congress title:
Proceedings of the International Conference on Simulation of Semiconductor Processes and Devices 
Congress (additional information):
SISPAD 2013, September 3-5, Glasgow, Scotland, UK 
Year:
2013 
Language:
en