We present a planar low-cost multichip module integration technology on a silicon substrate. It is designed for high frequency applications where bare dice are placed in substrate openings and connected through a thin film multilayer realized in a planar fashion on top of the embedded system. We discuss the technological realization and resulting properties of the suggested MCM concept. The paper also addresses high frequency performance of the described interconnecting technology pointing out the benefits for RF circuit design. Exemplary we analyze a microstrip transmission-line crossing including a three-dimensional full-wave modeling of the structure with the time-domain transmission-line matrix method     «

We present a planar low-cost multichip module integration technology on a silicon substrate. It is designed for high frequency applications where bare dice are placed in substrate openings and connected through a thin film multilayer realized in a planar fashion on top of the embedded system. We discuss the technological realization and resulting properties of the suggested MCM concept. The paper also addresses high frequency performance of the described interconnecting technology pointing out t...     »

3D full-wave modeling, bare dice placement, embedded system, HF performance, high frequency applications, integrated circuit interconnections, MCM integration technology, MCM-D technology, microstrip circuits, microstrip transmission-line crossing, multichip module integration, multichip modules, planar low-cost integration technology, RF circuit design, Si, Si substrate, silicon, substrate openings, substrates, thin film multilayer, thin film wiring system, time-domain TLM method, transmission line matrix methods, transmission-line matrix method, UHF integrated circuits     «

3D full-wave modeling, bare dice placement, embedded system, HF performance, high frequency applications, integrated circuit interconnections, MCM integration technology, MCM-D technology, microstrip circuits, microstrip transmission-line crossing, multichip module integration, multichip modules, planar low-cost integration technology, RF circuit design, Si, Si substrate, silicon, substrate openings, substrates, thin film multilayer, thin film wiring system, time-domain TLM method, transmission...     »