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Document type:
Konferenzbeitrag 
Contribution type:
Textbeitrag / Aufsatz 
Author(s):
Mock, J.; Pljevljakovic, T.; Kloberg, M.; Lyuleeva, A.; Rieger, B.; Becherer, M. 
Title:
2D Silicon encapsulation for electronic device fabrication 
Book / Congress title:
Graphene week 2019 
Congress (additional information):
Helsinki, Finland, 23-27 Sep 2019 
Year:
2019 
Quarter:
3. Quartal 
Year / month:
2019-09 
Month:
Sep 
Language:
en