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Document type:
Konferenzbeitrag 
Contribution type:
Poster 
Author(s):
Mock, J; Kloberg, M.; Rieger, B.; Becherer, M. 
Title:
Encapsulating 2D silicon towards real world applications 
Book / Congress title:
European Materials Research Society Spring Meeting (Nice, France), 2019 
Congress (additional information):
Nice, France, 27-31 May 2019 2019-05 
Year:
2019 
Quarter:
2. Quartal 
Year / month:
2019-05 
Month:
May 
Language:
en