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Dokumenttyp:
Konferenzbeitrag 
Art des Konferenzbeitrags:
Vortrag / Präsentation 
Autor(en):
Meister, T.; Ellinger, F.; Bartha, J.W.; Berroth, M.; Burghartz, J.; Claus, M.; Frey, L.; Gagliardi, A.; Grundmann, M.; Hesselbarth, J.; Klauk, H.; Leo, K.; Lugli, P.; Mannsfeld, S.; Manoli, Y.; Negra, R.; Neumaier, D.; Pfeiffer, U.; Riedl, T.; Scheinert, S.; Scherf, U.; Thiede, A.; Troster, G.; Vossiek, M.; Weigel, R.; Wenger, C.; Alavi, G.; Becherer, M.; Chavarin, C.A.; Darwish, M.; Ellinger, M.; Fan, C.-Y.; Fritsch, M.; Grotjahn, F.; Gunia, M.; Haase, K.; H...    »
 
Titel:
Program FFlexCom — High frequency flexible bendable electronics for wireless communication systems 
Seitenangaben Beitrag:
1-6 
Abstract:
Today, electronics are implemented on rigid substrates. However, many objects in daily-life are not rigid – they are bendable, stretchable and even foldable. Examples are paper, tapes, our body, our skin and textiles. Until today there is a big gap between electronics and bendable daily-life items. Concerning this matter, the DFG Priority Program FFlexCom aims at paving the way for a novel research area: Wireless communication systems fully integrated on an ultra-thin, bendable and...    »
 
Stichworte:
Thin film transistors, Wireless communication, Substrates, Integrated circuit modeling, Microwave antennas, Metals 
Kongress- / Buchtitel:
2017 IEEE International Conference on Microwaves, Antennas, Communications and Electronic Systems (COMCAS) 
Kongress / Zusatzinformationen:
Tel Aviv, Israel, 13-15 Nov 2017 2017-11 
Verlag / Institution:
IEEE Xplore Digital Library 
Jahr:
2017 
Quartal:
4. Quartal 
Jahr / Monat:
2017-11 
Monat:
Nov 
Seiten:
1-6 
Sprache:
en