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Document type:
Magazinartikel 
Author(s):
Andreas Herkersdorf, Hananeh Aliee, Michael Engel, Michael Glaß, Christina Gimmler-Dumont, Jörg Henkel, Veit Kleeberger, Michael Kochte, Johannes Maximilian Kühn, Daniel Müller-Gritschneder, Sani Nassif, Holm Rauchfuss, Wolfgang Rosenstiel, Ulf Schlichtmann, Muhammad Shafique, Mehdi Baradaran Tahoori, Jürgen Teich, Norbert Wehn, Christian Weis, Hans-Joachim Wunderlich 
Title:
Resilience Articulation Point (RAP): Cross-layer ependability modeling for nanometer system-on-chip resilience 
Keywords:
VirTherm 3D 
Dewey Decimal Classification:
620 Ingenieurwissenschaften 
Journal title:
Microelectronics Reliability 
Year:
2014 
Journal volume:
Volume 56 
Year / month:
2014-06 
Journal issue:
Issues 6-7 
Pages contribution:
pp 1066-1074 
Language:
en 
E-ISSN:
0026-2714 
TUM Institution:
Lehrstuhl für Integrierte Systeme