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Document type:
Zeitschriftenaufsatz 
Author(s):
Felix Miller, Thomas Wild, Andreas Herkersdorf 
Title:
Virtualized and Fault-Tolerant Inter-Layer-Links for 3D-ICs 
Keywords:
NEEDS 
Dewey Decimal Classification:
620 Ingenieurwissenschaften 
Journal title:
Microprocessors and Microsystems 
Year:
2013 
Journal volume:
Volume 37 
Year / month:
2013-11 
Journal issue:
Issue 8 
Pages contribution:
pp 823-835 
Publisher:
Elsevier B.V. 
E-ISSN:
0141-9331 
TUM Institution:
Lehrstuhl für Integrierte Systeme