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Document type:
Konferenzbeitrag
Contribution type:
Textbeitrag / Aufsatz
Author(s):
Mock, J.; Pljevljakovic, T.; Kloberg, M.; Lyuleeva, A.; Rieger, B.; Becherer, M.
Title:
2D Silicon encapsulation for electronic device fabrication
Book / Congress title:
Graphene week
Congress (additional information):
Helsinki, Finland, 23-27 Sep 2019-09
Year:
2019
Quarter:
3. Quartal
Year / month:
2019-09
Month:
Sep
Language:
en
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