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Document type:
Konferenzbeitrag
Author(s):
Zeppenfeld, M., Wardenberg, M., Rapp, C., Eblenkamp, M.
Title:
Protection of active implant electronics with organosilicon open air plasma coating for plastic overmolding
Book / Congress title:
BMT 2016 "Dreiländertagung" Swiss, Austrian and German Societies of Biomedical Engineering
Volume:
2
Publisher:
De Gruyter Current Directions in Biomedical Engineering 2016
Publisher address:
ja
Year:
2016
Pages:
35–38
Covered by:
Scopus
Bookseries title:
Current Directions in Biomedical Engineering 2016
Reviewed:
ja
Fulltext / DOI:
doi:10.1515/cdbme-2016-0011
WWW:
https://www.scopus.com/record/display.uri?eid=2-s2.0-85059814399&origin=resultslist&sort=plf-f&src=s&st1=Protection+of+active+implant+electronics+with+organosilicon+open+air+plasma+coating+for+plastic+overmolding&sid=99844dcfac48f31f9b3529c74467e749&sot=b&sdt=b&sl=122&s=TITLE-ABS-KEY(Protection+of+active+implant+electronics+with+organosilicon+open+air+plasma+coating+for+plastic+overmolding)&relpos=0&citeCnt=0
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