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Autor(en):
Mangold, T.; Wolf, J.; Topper, M.; Reichl, H.; Russer, P. 
Titel:
Multilayer Multichip Modules for Microwave and Millimeterwave Integration 
Abstract:
We present a planar integration technology of bare dices embedded in substrates (ceramic,silicon). A thin film multilayer with dielectric polymer layers and sputtered / electroplated wiring is realized in a planar fashion on top of the embedded system. The metalization is based on a Ti:W / Cu tie layer, which is subsequently electroplated with Cu. Polyimid Pyralin¿ (2722 (Du Pont) and Cyclotene¿ (4026-46 (Dow Chemical) are used as interlevel dielectric. The paper addresses high frequency perfo...    »
 
Kongress- / Buchtitel:
28th European Microwave Conference (EUMA) 
Band / Teilband / Volume:
Verlagsort:
Amsterdam, The Netherlands 
Jahr:
1998 
Monat:
oct 
Seiten:
443--448